Industry Leaders to Discuss Technology Trends at SEMICON Singapore

Advanced Packaging, Wafer Processing, Test Engineering, MEMS and Photovoltaic Segments Exhibition Now Open for Free Registration With a strong market outlook in 2010, key players from the semiconductor and photovoltaic industries will gather at the SEMICON Singapore 2010 conferences to discuss and analyze the future trends of advanced technologies and applications. Traditionally, Southeast Asia is the leading hub for semiconductor final assembly and test. However, recent investments in wafer fabs have transformed the region into a major player in front-end manufacturing as well. Southeast Asia is also a growing market in photovoltaic with several new PV manufacturing facilities in Singapore and Malaysia coming online in 2010 and beyond. Terry Tsao, the president of SEMI Taiwan and Southeast Asia, said, “These new plants will be searching for cost-effective local suppliers and service providers as they ramp to full production. To give industry participants a forum to showcase new technologies and products that will answer market demands, SEMI gathers leading microelectronic companies to present at programmes during this year’s SEMICON Singapore.” Exhibiting companies include ASE, GLOBALFOUNDRIES, Infineon, STMicroelectronics and Qualcomm. Along with advanced packaging, wafer packaging, product test engineering and solar, sessions on MEMS and 3D IC Packaging have also been added to the agenda. "MEMS is a fast-growing and emerging technology with great potential to enhance and add value to the semiconductor industry. Standardization of MEMS design, fabrication and packaging processes will accelerate the pace of early adoption of MEMS manufacturing by the industry," said Professor Dim. Lee Kwong, Executive Director of IME. Semiconductor manufacturers continue to face challenges pertaining to environmental sustainability and economic sustainability. In the Wafer Process Technology programme, Cabot Microelectronics, Data Storage, Lam Research and Novellus will discuss the latest solutions in CMP and NVM as well as strategies to enable environmental and economic sustainability. Product functionality, time-to-market, and cost are becoming critical factors in the consumer electronics market, changing how semiconductor devices are thinned, die-attached, wire bonded, and encapsulated. New packaging technologies, such as 3D and WLP, are playing a major role in delivering solutions to meet these needs. "3D packaging brings with it a whole new spectrum of processes, materials, equipment, and the related process, quality, and reliability issues," said Charles Vath, VP of Process and Package Development, ASM. These new packaging technologies also place more demands on device test, making this one of the critical factors in the overall process for driving down cost and increasing product quality. In the Product Test Engineering Forum, GLOBALFOUNDRIES and FormFactor will share their test strategies from a foundry perspective, while Qualcomm and other industry leaders will offer insights on cost reduction. The SEMICON Singapore 2010 exhibition will be held at the Suntec Singapore Convention Center, May 19-21. A series of technical and market seminars will be held in conjunction with the show. Keynote speakers from Applied/ EPIA, IME, Infineon and Qualcomm will cover topics ranging from a semiconductor market forecast, MEMS, Advanced Packaging, 3D and Wafer Level Packaging, and Product Test Engineering to Solar Industry Trends. Admission to the programmes and exhibition area is free. For more information, visit www.semiconsingapore.org. About SEMI SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Austin, Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org .

• ข่าวSEMICON Singapore
• ข่าวExhibition
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