AUSTIN, Texas and CARLSBAD, Calif., June 25 /PRNewswire-FirstCall-AsiaNet/ --
Motorola, Inc.'s (NYSE: MOT) Semiconductor Products Sector and DuPont Air Products NanoMaterials LLC ("DA NanoMaterials") plan, under the terms of a recent agreement, to collaborate on an advanced copper chemical mechanical planarization (CMP) formulation. Motorola will provide its CMP formulation for 0.13 to 0.10 micron design rules to DA NanoMaterials which will manufacture and market the slurry formulation globally. DA NanoMaterials is a 50/50 joint venture between Air Products and Chemicals, Inc. (NYSE: APD) and DuPont (NYSE: DD).
Copper slurry is a liquid chemical abrasive that enables the removal of unwanted bulk copper off of the surface of the wafer during the semiconductor manufacturing process. The remaining copper, defined by the inlaid structures on the semiconductor etched from the oxide interlevel dielectric layer, provides the metal interconnect structures. Motorola, as one of the world's leading manufacturers of semiconductor products, has developed a copper CMP slurry that has been demonstrated to provide exceptional performance on high volume production lines. The slurry has been refined over the last three generations of advanced copper interconnect processing to enhance the key attributes required to successfully produce sub 0.13um devices.
DA NanoMaterials was formed in January 2000 to manufacture and market CMP slurries, abrasives and related components. DA NanoMaterials and Motorola have worked closely together for the last 18 months to optimize the formulation and will now expand their relationship to market and sell the product globally.
Under the long-term agreement, the advanced slurry will be marketed under DA NanoMaterials' Ascend(R) trademark. Motorola will provide for the transfer of the licensed technology, as well as technical support and training while DA NanoMaterials will provide the capability for installation, manufacture of the slurry and quality control via its world-class production facility in Ruabon, Wales.
The fully formulated copper slurry provides copper removal rates in excess of 5000 A/min and very low dishing and erosion. The slurry also has exceptional stability and is compatible with most slurries used for the barrier metal layers. It is one of the few copper slurries with demonstrated performance in high volume manufacturing, providing a reduced cost of ownership for the copper CMP process.
"We have worked for a number of years to develop a copper slurry that can withstand the rigors of today's complex system-on-a-chip product demands," said Dr. Louis C. Parrillo, SPS chief technology officer, corporate vice president & director, DigitalDNA Labs. "By partnering with DA NanoMaterials, we will now be able to bring this solution to the general market and receive the benefits of establishing an industry standard."
"DuPont Air Products NanoMaterials is committed to the development of leading-edge technology for CMP and wafer polishing slurries in the marketplace," noted Robert B. Grashoff, chief executive officer of DA NanoMaterials. "Our relationship with Motorola will allow us to include a copper slurry in our product portfolio that will provide customers with a high performing, cost effective solution for the first step copper polishing process. We will be able to offer these benefits now and in the future by combining an advanced copper process developed by Motorola, along with the global supply chain, application support and slurry expertise demonstrated by DA NanoMaterials."
The total current CMP slurry market is valued at approximately $300 million and is expected to grow at an annual rate in excess of 20 percent during the next three years. The copper CMP slurry market is estimated to be $50 million of the overall total, but is expected to grow at least three times faster than the overall CMP slurry market.
***NOTE: Forward-Looking Statements: This news release contains forward- looking statements based on management's current expectations, estimates and projections. All statements that address expectations or projections about the future, including statements about the joint venture company's strategy for growth, product development, market position, expected expenditures and financial results are forward-looking statements. Some of the forward-looking statements may be identified by words like "expects," "anticipates," "plans," "intends," "projects," "indicates," and similar expressions. These statements are not guarantees of future performance and involve a number of risks, uncertainties and assumptions. Many factors, including those discussed more fully elsewhere in this release and in DuPont and Air Products' filings with the Securities and Exchange Commission, particularly their latest annual reports on Form 10-K, as well as others, could cause results to differ materially from those stated. These factors include, but are not limited to changes in the laws, regulations, policies and economic conditions of countries in which the companies do business; competitive pressures; successful integration of structural changes, including acquisitions, divestitures and alliances; and research and development of new products, including regulatory approval and market acceptance.
SOURCE: DuPont Air Products NanoMaterials LLC
CONTACT: Media Inquiries: Steve Howard of Motorola,
+1-512-895-6335,
Catherine E. McDonald of Air Products,
+1-610-481-3673,
Anthony R. Farina of DuPont,
+1-302-774-4114, or
Investor Inquiries: Bob Hubberts of Motorola,
+1-847-576-4995,
Alexander W. Masetti of Air Products,
+1-610-481-7461,
Raymond G. Anderson of DuPont,
+1-302-774-1125,
Web site: http://www.airproducts.com
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